The International Technology Roadmap for Semiconductors is sponsored by the five leading chip manufacturing regions in the world: Europe, Japan, Korea, Taiwan, and the United States. The sponsoring organizations are the European Semiconductor…
Processes
In this subdiscipline:
20,105 papers
Popular papers
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Graphene sheets-one-atom-thick two-dimensional layers of sp2-bonded carbon-are predicted to have a range of unusual properties. Their thermal conductivity and mechanical stiffness may rival the remarkable in-plane values for graphite (approximately…
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First present a PRAM with confinement of chemically vapor deposited GeSbTe (CVD GST) within high aspect ratio 50 nm contact for sub 50 nm generation PRAMs. By adopting confined GST, we were able to reduce the reset current below ~260 muA and…
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Different techniques of the X-ray diffraction line profile analysis (XRDLPA) have been used to study the microstructural parameters of the heavily deformed solid polycrystalline Zircaloy-2 and Zr-2.5%Nb alloys. The domain size, microstrain within…
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A new tool material for cold forging applications was developed using numerical simulation techniques (FEM) for the design and a powder metallurgical route (HIP) for the production. The basic idea was to find an optimized microstructure of the two…
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In recent years, it has been shown that the problem of defect accumulation under cascade damage conditions can be properly addressed within the framework of production bias model (PBM) based on intracascade clustering of point defects, differences…
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The literature on grain refinement of magnesium alloys is reviewed with regard to two broad groups of alloys: alloys that contain aluminum and alloys that do not contain aluminum. The alloys that are free of aluminum are generally very well refined…
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Topology optimization is used to systematically design periodic materials that are optimized for multiple properties and prescribed symmetries. In particular, mechanical stiffness and fluid transport are considered. The base cell of the periodic…
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Equal channel angular pressing is an innovative process for obtaining severe plastic deformations in materials. In this work an optimised design of the channel die is presented which improves deformations obtained in materials using standard dies.
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International cooperation in the field of cold forging technology started in 1961 by formation of the OECD Group of Experts on Metal Forming. In 1967 this group was transformed into the International Cold Forging Group, ICFG, an independent body…
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The new intense plastic straining technique, named `constrained groove pressing' (CGP), was developed for fabrication of plate-shaped ultrafined grained metallic materials without changing their initial dimensions. The principle of CGP is that a…
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GaN community has recently recognized that it is imperative that the extended, and point defects in GaN and related materials, and the mechanisms for their formation are understood. This is a first and an important step, which must be followed by…
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PRAM(Phase-Change RAM) is a promising memory that can solve the problems of conventional memory and has the nearly ideal memory characteristics. We reviewed the issues for high density PRAM integration. Writing current reduction is the most urgent…
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All-printed electronics is the key technology to ultra-low-cost, large-area electronics. As a critical step in this direction, we demonstrate that laser sintering of inkjet-printed metal nanoparticles enables low-temperature metal deposition as well…
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Active members
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ProfessorSuzuka National College of Technology -
Other ProfessionalLinkedbiz Labs -
Ph.D. StudentInstitut für Textil- und Verfahrenstechnik -
Senior LecturerGraduate School of Engineering, Kyoto University
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Student (Master)Tehrān, Iran