A 64Mb SRAM macro is fabricated in a 32nm high-k metal-gate (HKMG) SOI technology [1]. Figure 14.1.1 shows the 0.154μm2 bitcell (BC). A 2x size reduction from the previous 45nm design [2] is enabled by an equal 2x reduction in BC area. No corner rounding of BC gates allows tighter overlay of gate electrode and active area. The introduction of HKMG provides a significant reduction in the equivalent oxide thickness, thereby reducing the Vt mismatch. This reduction allows aggressive scaling of device dimensions needed to achieve the small area footprint. A 0.7V VDDMIN operation is enabled by three assist features. Stability is improved by a bitline (BL) regulation scheme. Enhancements to the write path include an increase of 40% of BL boost voltage. Finally, a BC-tracking delay circuit improves both performance and yield across the process space. © 2011 IEEE.
CITATION STYLE
Pilo, H., Arsovski, I., Batson, K., Braceras, G., Gabric, J., Houle, R., … Radens, C. (2011). A 64Mb SRAM in 32nm high-k metal-gate SOI technology with 0.7V operation enabled by stability, write-ability and read-ability enhancements. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (pp. 254–255). Institute of Electrical and Electronics Engineers Inc. https://doi.org/10.1109/ISSCC.2011.5746307
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