Crack initiation and growth in surface mount solder joints
- ISSN: 0277786X
Abstract
Thermal fatigue tests were conducted on leadless chip carrier/PC board assemblies under several different conditions. The temperature range was varied from -55°C<->125°C to 25°C<->75°C, and the cyclic frequency was varied from 144 cycles/day to 2 cycles/day. All of the tests were conducted using 62Sn36Pb2Ag, with 3 additional tests using 60Sn40Pb. Crack growth was measured by removing three chip carriers from the sample population at regular intervals. The number of cycles to crack initiation and the crack growth rate per cycle were correlated with both the inelastic strain range and the strain energy density by using non-linear finite element analysis. Based on these correlations, it is possible to calculate the fatigue life of any solder joint under any use condition
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