Dynamic Crack Propagation Prediction of Solder Joints under Impact Conditions
2007 Proceedings 57th Electronic Components and Technology Conference (2007)
- ISSN: 05695503
- ISBN: 1424409845
- DOI: 10.1109/ECTC.2007.373871
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Readership Statistics
3 Readers on Mendeley
by Discipline
100% Engineering
by Academic Status
67% Ph.D. Student
33% Researcher (at a non-Academic Institution)
by Country
67% United States

