Farewell to flatland

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Abstract

For 40 years, chipmakers have done what they can to reduce the area of their electronic circuits. But they are getting to the limits of what they can do. Although 3D integration still has its problems, the time is coming when the only way the semiconductor industry can go is up.

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APA

Edwards, C. (2008). Farewell to flatland. Engineering and Technology, 3(2), 38–41. https://doi.org/10.1049/et:20080203

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