Ultra high precision grinding can render sub-micrometric surface finish of workpieces in an effective way. Accordingly, grinding in the nano-level can be used to produce surface finish of nanometric level or removal of several atomic layers of the substrate. As direct measurements in this scale are either expensive or impossible to be conducted, appropriate simulation models need to be created in order to study the underlying mechanisms of nanometric machining processes. Molecular Dynamics (MD) method is a widely accepted simulation method for this purpose, as it enables direct observation of the process at atomistic level. In this study, an MD simulation of nanometric peripheral grinding with two single crystal diamond grains is conducted with a view to determine cutting forces and temperatures as well as surface integrity and subsurface damage in the workpiece. Using this model, favourable cutting conditions for this process will be able to be determined.
Karkalos, N. E., Markopoulos, A. P., & Kundrák, J. (2017). Molecular Dynamics Model of Nano-metric Peripheral Grinding. In Procedia CIRP (Vol. 58, pp. 281–286). Elsevier B.V. https://doi.org/10.1016/j.procir.2017.03.189