Heterogeneous integration by adhesive bonding

Abstract

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.