Abstract
This paper reviews the current status and future outlook of materials for 193 nm immersion lithography, with special focus on top barrier layers, photoresists, bottom antireflective coatings for numerical apertures exceeding unity, and future challenges for imaging materials along the Roadmap.
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CITATION STYLE
APA
Dammel, R. R., Houlihan, F. M., Sakamuri, R., Rentkiewicz, D., & Romano, A. (2004). 193 nm immersion lithography - Taking the plunge. Journal of Photopolymer Science and Technology. Tokai University. https://doi.org/10.2494/photopolymer.17.587
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