Microstructure scaling of metal-insulator transition properties of VO2 films

12Citations
Citations of this article
19Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

The metallic to semiconducting resistivity ratios and the transition temperature sharpness of annealed atomic layer deposited VO2 films on amorphous silicon dioxide are found to depend on the grain size in a closely similar way to films from previous sputtered or pulse laser deposited work. This occurs because the dominance of grain growth and compaction processes leads to a common scaling of properties with the grain size. Density functional simulations find that V-V dimerizations allow grain boundaries to remain semiconducting but with a reduced bandgap, while others create metallic grain boundaries, reducing the resistivity ratio for smaller grains in both cases.

Cite

CITATION STYLE

APA

Niang, K. M., Bai, G., Lu, H., & Robertson, J. (2021). Microstructure scaling of metal-insulator transition properties of VO2 films. Applied Physics Letters, 118(12). https://doi.org/10.1063/5.0039607

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free