Thermal and Power Management Challenges in High-Performance Mobile Processors

Abstract

A significant computational capability to just a few cubic centimeters has been enabled by highperformance mobile processors that are rapidly evolving. Unfortunately, the increase in transistor density and clock speed, along with the integration of additional features, create prohibitive challenges with thermal output and power consumption. In this paper, we critically discuss key thermal and power management issues in modern mobile processors: thermal design power (TDP), energy efficiency tradeoffs, and the implications of thermal throttling on performance. Dynamic voltage and frequency scaling (DVFS), thermal aware task scheduling and sophisticated cooling mechanisms are reviewed. Emerging challenges posed by the integration of AI accelerators and 5G connectivity are also presented. Insights for future directions in sustainable processor design conclude the study