Diffusion bonding of Cu-Cu with Al-Ni nano multilayers

Abstract

The paper examines the joinability, microstructures and thermal behaviors of the AlNi nano multilayers. The results reveal the transitions and possible compositions of the nano multilayers when heating. Nanoscale Al-Ni multilayers could be used in Cu-Cu diffusion joining though the process and preparation method need to be optimized. © 2013 The Japan Institute of Metals and Materials.