Thermal properties of maize seed components

Abstract

Maize (Zea Mays L.) is one of the cereals most consumed worldwide, not only because of food uses but also because of its industrial uses. Physical processes are used when transforming maize industrially, particularly thermal processes are employed. Because of this, it is necessary to enhance the industrial procedures that constitute the grain processing chain. The additional information that allows advances in procedures and techniques in commodities like cereals gives an advantage to the food industry. The processes that involve temperature are benefiting of thermal properties knowledge. Therefore, maize thermal properties of each component are studied. Three standard varieties of maize seeds (GSV2, SLP, and P6) were thermally characterized. Photopyroelectric and open photoacoustic cell techniques were employed for characterization. The maize analyzed components were pericarp, endosperm (floury and vitreous), and germ. The outer maize layer’s pericarp presents the lowest thermal conductivity for GSV2 and P6 samples, whereas the P6 sample components have similar thermal conductivity values. The obtained results show a thermal impedance between some of the maize components. The presented information can be used to improve the maize thermal process transformation.