Time Variation of Insertion Cu On TiO2 Nanoparticles Layer Through The Electroplating Method In Dye-Sensitized Solar Cell (DSSC)

Abstract

Copper (Cu) is a conductive metal. Insertion of copper on a TiO 2 active layer is the right choice in the effort to improve Dye-Sensitized Solar Cell (DSSC) performance. Electroplating methods were used in this study to insert copper in the TiO 2 layer. The device of DSSC used in this study is natural dye Moringa Oleifera, TiO 2 -Cu electrode, the counter electrode of Pt and electrolyte from NaI. The peak absorbance of dye is at wavelength 415 nm and maximum efficiency is 0,093 % from the time variation electroplating of 25 s. There is increase efficiency from TiO 2 to TiO 2 -Cu electrode with time variation of electroplating. It is shown that insertion of copper in the TiO 2 nanoparticles layer improves the performance of DSSC.