Copper - HTS hybrid conductor architecture

Abstract

Plating of a copper layer using an aqueous copper sulfate electrolytic deposition on the surface of CC is described. The paper focuses on basic electrical and chemical parameters. High concentration copper sulfate solution of 150 - 250 g/l with low content of sulfur acid solution at electrolytic current densities of 30 - 50 mA/cm2 delivers fine grained stable Cu layers. A noble metal (Ag, Au) seed layer improves the deposition speed and the tape surround plating. Pulse plating increases the plating efficiency and is utilized in a developed reel - to - reel plating unit to deposit a Cu shunt on CC continuously. Mixed electrolytic solutions are the electrochemical basis for CuNi and brass deposition. Practical solder joints are obtained using Sn-Pb-Cu standard soldering at temperature of 250 °C A joint resistance of 0.2μΩcm2 could be obtained routinely in practical CC assembling. © 2010 IOP Publishing Ltd.