Effect of inulin incorporation on physicochemical properties of heat-moisture treated wheat starch and noodle quality

2Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

This study investigated the effect of different ratios of inulin on the physicochemical properties of wheat starch following heat-moisture treatment (HMT). Inulin was compounded by heat-moisture treatment of wheat starch (HWS), and noodles were prepared to evaluate the quality properties of noodles and their relationship with the physicochemical properties of starch. The experimental results demonstrated that blending HWS with inulin at various ratios (0.0%, 2.5%, 5.0%, and 7.5%) enabled the analysis of multiscale structural changes in granule morphology (SEM), crystallinity (XRD), short-range molecular order (FT-IR), and particle size distribution**, thermal properties (DSC), and pasting properties (RVA). These findings indicated that the incorporation of 5.0% inulin resulted in a significant reduction in starch granule aggregation, an increase in specific surface area, and an improvement in cooking stability. Texture analysis indicated an enhancement in the cohesiveness of the noodles, while sensory evaluation highlighted an optimal balance of flavor and texture with 5.0% inulin. This study proposes a novel approach for the development of functional noodles that exhibit enhanced nutritional and sensory attributes, thereby catering to the consumer demand for healthy staple foods.

Cite

CITATION STYLE

APA

Ji, J., Lan, H., Gao, J., Yang, C., Zhou, Y., Wu, C., … Sun, Y. (2025). Effect of inulin incorporation on physicochemical properties of heat-moisture treated wheat starch and noodle quality. International Journal of Food Properties, 28(1). https://doi.org/10.1080/10942912.2025.2574411

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free