Progress of Polymer-Based Thermally Conductive Materials by Fused Filament Fabrication: A Comprehensive Review

Abstract

With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability. However, the thermal conductivity of polymers is insufficient to meet heat dissipation requirements, and their improvements remain challenging. For decades, as an efficient manufacturing technology, additive manufacturing has gradually attracted public attention, and researchers have also used this technology to produce new thermally conductive polymer materials. Here, we review the recent research progress of different 3D printing technologies in heat conduction and the thermal conduction mechanism of polymer matrix composites. Based on the classification of fillers, the research progress of thermally conductive materials prepared by fused filament fabrication (FFF) is discussed. It analyzes the internal relationship between FFF process parameters and the thermal conductivity of polymer matrix composites. Finally, this study summarizes the application and future development direction of thermally conductive composites by FFF.