Sn-Pb and lead free solders containing active carbon particles

Abstract

Upon the legislations issued by the governmental agencies, many companies are in effort of using lead free solders for their electronic products. Many researchers have also focused on lead free solders and determined their physical properties to the merit of their desired strength and conductivity which turns out to be a potentially advantageous after all. The addition of nano particles into the solder alloys has been attempted to investigate the property change caused by such addition from which a main outcome was a limited improved mechanical and physical properties such as lowering the melting temperature. In this study, the addition of nano active carbon particles to Pb-Sn and Pb-free solder alloys were made and characterization studies were conducted to determine their basic properties such as electrical conductivity, microstructural study and also phase transformations. The results indicate that the addition of active carbon particles brings about a change in thermal properties more markedly than other properties with respect to the amount of addition.