The effect of rare earths additions on the microstructure and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy

Abstract

Sn-0.7Cu-0.075Al solder alloy adding with Ce and La had been successfully prepared by applying ball-milling and vacuum arc remelting. The influence of Ce and La on microstructure and corrosion behavior of Sn-0.7Cu-0.075Al solder alloy was investigated. The results showed that Ce (La)-containing solders had refined grains and obvious directional tendency due to the dispersive refiner (CeO2 and La2O3). Electrochemical potentiodynamic curves revealed three different stages of the reaction, including anodic and cathodic processes, prepassivation section, and stable passivation stages. The self-corrosion potential (Ecorr) of alloys with Ce and La addition were a little bit more negative, hardly making a difference on corrosion occurrence. However, the corrosion current density (Icorr) and passivation current density (Ip) decreased by two-thirds and one-half respectively, which indicated a better corrosion resistant after adding rare earths. The recorded micrographs of corroded surface at different polarized points witnessed the formation of corrosion product film both on prepassivation and passivation stage. Moreover, the cross section of corrosion product film showed the coarse, loose film in Sn-0.7Cu-0.075Al solder and adherent, compact film in Ce (La)-containing solders, which further indicated an excellent anti-corrosion property.