Recrystallization Behavior at Diffusion Bonding Interface of High Nb Containing TiAl Alloy

Abstract

A series of diffusion bonding tests are conducted on a high Nb containing TiAl alloy with full lamellar (FL) microstructure and the effect of interfacial recrystallization behavior on the shear strength is discussed. Microstructural observations reveal that bonding above 1 100 °C and 30 MPa results in recrystallization at the bonding interface flanked by FL microstructure, thus promoting the interface migration and leading to a sound joint. Based on the present results, the nucleation mechanism of recrystallization at the bonding interface is studied. Shear testing results show that recrystallization at the bonded zone improves the bonding quality of the joints by changing the failure mode. The shear strength of the joints attains 400 MPa when bonding at 1 150 °C/30 MPa/45 min and 1100 °C/40 MPa/45 min.