Skip to main content

Bottom-Up Fabrication of Semiconductive Metal–Organic Framework Ultrathin Films

Citations of this article
Mendeley users who have this article in their library.
Get full text
This PDF is freely available from an open access repository. It may not have been peer-reviewed.


Though generally considered insulating, recent progress on the discovery of conductive porous metal–organic frameworks (MOFs) offers new opportunities for their integration as electroactive components in electronic devices. Compared to classical semiconductors, these metal–organic hybrids combine the crystallinity of inorganic materials with easier chemical functionalization and processability. Still, future development depends on the ability to produce high-quality films with fine control over their orientation, crystallinity, homogeneity, and thickness. Here self-assembled monolayer substrate modification and bottom-up techniques are used to produce preferentially oriented, ultrathin, conductive films of Cu-CAT-1. The approach permits to fabricate and study the electrical response of MOF-based devices incorporating the thinnest MOF film reported thus far (10 nm thick).




Rubio-Giménez, V., Galbiati, M., Castells-Gil, J., Almora-Barrios, N., Navarro-Sánchez, J., Escorcia-Ariza, G., … Martí-Gastaldo, C. (2018). Bottom-Up Fabrication of Semiconductive Metal–Organic Framework Ultrathin Films. Advanced Materials, 30(10).

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free