Material properties in thermal-stress analysis - Photoelastic materials are evaluated on their application to a transient-thermal-stress analysis

Abstract

With simple techniques and not too-costly laboratory equipment, the significant material properties in modeling transient thermal stresses by photothermoelasticity are evaluated. The results are presented for a room-temperature-cured epoxy, a hot-cured epoxy and a polycarbonate. The materials tested are also evaluated on their applicability to a transient-thermal-stress analysis. © 1981 Society for Experimental Mechanics, Inc.