(Invited) 2.5D Advanced System-in-Package: Processes, Materials & Integration Aspects

Abstract

Semiconductor scaling is expected to face several disruptive challenges in the next several years. These challenges need to be especially resolved within constraints of mobile platform of low cost and small form factor. 2.5D advanced system-in-package with low cost interposers would be valuable in addressing these challenges. Some examples of glass interposer have been used to discuss processes, materials and integration aspects of 2.5D advanced system-in-package.