A fabrication of germanium nanocrystal embedded in silicon-oxygen-nitride layer

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Abstract

The formation of germanium nanocrystals embedded in silicon-oxygen-nitride (SiON) layer acting as distributed charge storage elements is proposed in this work. A large memory window is observed due to the isolated Ge nanocrystals in the SiON gate stack layer. The Ge nanocrystals were nucleated after the high-temperature oxidation of SiGeN layer. The nonvolatile memory device with the Ge nanocrystals embedded in SiON stack layer exhibits 4 V threshold voltage shift under 7 V write operation. Also, the sequent high-temperature oxidation of the SiGeN layer acting as the blocking oxide is proposed to enhance the performance of nonvolatile memory devices. © 2006 The Electrochemical Society.

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Tu, C. H., Chang, T. C., Liu, P. T., Liu, H. C., Weng, C. F., Shy, J. H., … Chang, C. Y. (2006). A fabrication of germanium nanocrystal embedded in silicon-oxygen-nitride layer. Electrochemical and Solid-State Letters, 9(12), 358–360. https://doi.org/10.1149/1.2357983

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