InP-based photodetectors monolithically integrated with 90° hybrid toward over 400 Gb/s coherent transmission systems

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Abstract

We present InP-based photodetectors monolithically integrated with a 90° hybrid toward over 400 Gb/s coherent transmission systems. To attain a wide 3-dB bandwidth of more than 40 GHz for 400 Gb/s dual-polarization (DP)-16-ary quadrature amplitude modulation (16QAM) and 600 Gb/s DP-64QAM through 64 GBaud operation, A p-i-n photodiode structure consisting of a GaInAs thin absorption and low doping ntyped InP buffer layers was introduced to overcome the trade-off between short carrier transit time and low parasitic capacitance. Additionally, this InP buffer layer contributes to the reduction of propagation loss in the 90° hybrid waveguide, that is, this approach allows a high responsivity as well as wide 3-dB bandwidth operation. The coherent receiver module for the C-band (1530 nm - 1570 nm) operation indicated the wide 3-dB bandwidth of more than 40 GHz and the high receiver responsivity of more than 0.070A/W (Chip responsivity within the C-band: 0.130A/W) thanks to photodetectors with this photodiode design. To expand the usable wavelengths in wavelength-division multiplexing toward large-capacity optical transmission, the photodetector integrated with the 90° hybrid optimized for the L-band (1565 nm - 1612 nm) operation was also fabricated, and exhibited the high responsivity of more than 0.120A/W over the L-band. Finally, the InP-based monolithically integrated photonic device consisting of eight-channel p-i-n photodiodes, two 90° hybrids and a beam splitter was realized for the miniaturization of modules and afforded the reduction of the total footprint by 70% in a module compared to photodetectors with the 90° hybrid and four-channel p-i-n photodiodes.

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Yagi, H., Okimoto, T., Inoue, N., Ebihara, K., Sakurai, K., Kurokawa, M., … Yoneda, Y. (2019). InP-based photodetectors monolithically integrated with 90° hybrid toward over 400 Gb/s coherent transmission systems. IEICE Transactions on Electronics, E102C(4), 347–356. https://doi.org/10.1587/transele.2018ODI0006

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