Three-dimensional integration of semiconductors: Processing, materials, and applications

0Citations
Citations of this article
6Readers
Mendeley users who have this article in their library.
Get full text

Abstract

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Cite

CITATION STYLE

APA

Kondo, K., Takahashi, K., & Kada, M. (2015). Three-dimensional integration of semiconductors: Processing, materials, and applications. Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications (pp. 1–408). Springer International Publishing. https://doi.org/10.1007/978-3-319-18675-7

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free