Effects of high polyamic acid content and curing process on properties of epoxy resins

Abstract

Epoxy/polyamic acid (EP/PAA) adhesives with high polyimide precursor-PAA content have been synthesized and then cured. The structure, thermal, and adhesive properties were investigated by Fourier transform infrared spectroscopy, thermogravimetric analysis, and tensile shear test. The effects of PAA content and curing process on the tensile shear strength were also studied. The results showed that the addition of PAA improved the heat resistance and reduced the water absorption. EP/PAA adhesive kept good adhesion. A kind of EP/PAA composite adhesive with excellent comprehensive properties was prepared in this study.