Dependence of incident angle of surface morphology of polycrystalline copper after helium ion irradiation

Abstract

Polycrystalline copper at room temperature was irradiated with 5 keV helium ions by changing the incident angle and the ion fluence. The surface morphology was observed for the irradiated Cu. Many blisters with different sizes were observed on the irradiated sample. With the increase of incident angle, θ, (up to 45°), the average size of the blister remained almost the same while the surface density of the blister decreased. When the incident angle was 67.5°, the average size and height of blister became large owing to the blister evolution. In the case of θ = 67.5°, the surface density of the blister rapidly decreased, and the size of the blister gradually increased with the increase of ion fluence.