Improved high temperature strength of copper-graphene composite material

18Citations
Citations of this article
25Readers
Mendeley users who have this article in their library.

Abstract

The strength of polycrystalline materials at high temperatures is limited due to their poor resistance to grain boundary motion. A strategy to anchor the grain boundary of copper in 2-dimensional curvature by graphene was proposed and the copper-graphene composite was therefore fabricated. It was found that the hardness of Cu-0.5 wt% graphene (GN) composite is almost same with that of Cu-0.5 wt% graphite (GP) composite between room temperature and 450 °C. However, the hardness of Cu-GN composite improves significantly above 450 °C and is nearly twice of that of Cu-GP composite at 600 °C, indicating the hindrance effect of graphene on the atom diffusion across grain boundary at high temperatures. On the other hand, the thermal expansion coefficient is lower for Cu-GN composite compared with that of Cu-GP composite, and the electrical conductivity of the Cu-0.5 wt% GN composite remains 95.9 IACS%.

Cite

CITATION STYLE

APA

Wang, X., Li, J., & Wang, Y. (2016). Improved high temperature strength of copper-graphene composite material. Materials Letters, 181, 309–312. https://doi.org/10.1016/j.matlet.2016.06.034

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free