Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

Abstract

Highlights 3D electronics were efficiently created by a hybrid additive manufacturing method. Effect of laser on the deposition behavior of Cu on PEEK was studied. The main factor that affects the accuracy of plated Cu was revealed. A hydrophobic treatment was used to improve the resolution of circuits. Cu lines of 60 μm were obtained on both as-printed and polished PEEK.