Cathodic arc evaporation in thin film technology

Abstract

This article analyzes the present status of cathodic arc evaporation. Advantages of this technique are given by some characteristic features of arc metallic plasma, e.g., high ionization degree, multiple ionization, operation up to ultrahigh vacuum conditions, etc. The first part of the paper outlines the development of cathodic arc evaporation and focuses on arc plasma and methods for suppression of macroparticle content in growing films. The second part deals with both theoretical and experimental results of processes during interaction of arc plasma with the substrate and the growing film, mainly for Ti arc plasma in a wide range of ion energy.