Nickel Germanide Thin Films by Atomic Layer Deposition

Abstract

This work presents preparation of nickel germanide (Ni2Ge) thin films by atomic layer deposition (ALD). The films were grown using NiCl2(tmpda) (tmpda = N,N,N′,N′,-tetramethyl-1,3-propanediamine) and tributylgermanium hydride serving as a new, efficient reducing agent. This is the first time ALD NixGey films are prepared directly upon the combination of two precursors and without any annealing treatment. NixGey is an important contact material for enabling Ge-based transistors and thus circumventing the scaling issues related to current microelectronics. The Ni2Ge process was examined at low temperatures of 160-200 °C. Self-limiting, saturative growth with a high growth rate of 0.91 Å/cycle was observed at 180 °C. The films were thoroughly analyzed in terms of morphology, crystallinity, composition, and resistivity. The Ni2Ge films were pure, with the sum of contaminants being less than 1 at. %. Owing to their high purity, the films exhibited low resistivity, suggesting suitability for contact applications.