CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications

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Abstract

This paper presents a fully electronic, CMOS-compatible ultrasonic sensing system integrated into a 3D beamforming architecture for advanced automotive applications. The proposed system eliminates mechanical scanning by implementing a dual-path beamforming structure comprising programmable transmit (TX) and receive (RX) paths. The TX beamformer introduces per-element time delays derived from steering angles to control the direction of ultrasonic wave propagation, while the RX beamformer aligns echo signals for spatial focusing. Electrostatic actuation governs the CMOS-compatible ultrasonic transmission mechanism, whereas dynamic modulation under acoustic pressure forms the reception mechanism. The system architecture supports full horizontal and vertical angular coverage, leveraging delay-and-sum processing to achieve electronically steerable beams. The system enables low-power, compact, and high-resolution sensing modules by integrating signal generation, beam control, and delay logic within a CMOS framework. Theoretical modeling demonstrates its capability to support fine spatial resolution and fast response, making it suitable for integration into autonomous vehicle platforms and driver-assistance systems.

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APA

Hussain, K., Jeon, W., Lee, Y., Song, I. H., & Oh, I. Y. (2025, August 1). CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications. Applied Sciences (Switzerland). Multidisciplinary Digital Publishing Institute (MDPI). https://doi.org/10.3390/app15169201

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