Broadband microwave-based metrology platform development: Demonstration of in-situ failure mode diagnostic capabilities for integrated circuit reliability analyses

10Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.

Abstract

In this paper, we discuss the use of broadband high frequency electromagnetic waves (RF) to non-destructively identify, classify and characterize performance-limiting defects in emerging nanoelectronic devices. As an illustration, the impact of thermal cycling on the RF signal characteristics (insertion loss (S21) and return loss (S11)) is used to infer thermo-mechanical stress-induced defects in metal interconnects. The inferred defects are supported with physical analytical data where possible.

Cite

CITATION STYLE

APA

You, L., Okoro, C. A., Ahn, J. J., Kopanski, J., Franklin, R. R., & Obeng, Y. S. (2015). Broadband microwave-based metrology platform development: Demonstration of in-situ failure mode diagnostic capabilities for integrated circuit reliability analyses. ECS Journal of Solid State Science and Technology, 4(1), N3113–N3117. https://doi.org/10.1149/2.0151501jss

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free