The anodic dissolution of copper in acidic chloride media was studied at arotating disk electrode by the linear potential sweep method. The potentialrange from the rest potential to +400 mV vs. SCE, including a limiting currentregion, was investigated. Twenty different solutions of various chloride ionconcentrations from 0.2 to 4M and various [K+] to [H+] ratios were tested.The observed anodic limiting current density was proportional to the squareroot of the rotation rate. A model, which assumes the formation of a CuClfilm on the copper surface and diffusion of the chloride ions to the electrodeas the rate-determining step, has been developed to interpret the experimentaldata. Complexation constants, K2 and K3 are calculated as 6.67 � 104 and1.81 � 105, respectively, and K3/K2 = 2.67. These results lead to the conclusionthat in solutions with [Cl-] < 0.7M the complex, CuCl2-, is dominant, whileat more concentrated chloride solutions, CuCl32- is the main complex formed.For [Cl-] < 0.05M, a considerable amount of the dissolved copper is in theform of Cu2+. This restricts the proposed mechanism for anodic dissolutionof copper to solutions of higher chloride concentrations. The calculations donot preclude the validity of a previously proposed mechanism which suggeststhat diffusion of the cuprous chloride complex to the bulk of the solution isthe rate-determining step.
CITATION STYLE
Braun, M., & Nobe, K. (1979). Electrodissolution Kinetics of Copper in Acidic Chloride Solutions. Journal of The Electrochemical Society, 126(10), 1666–1671. https://doi.org/10.1149/1.2128773
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