Normally-off β-Ga2O3 MOSFET with an Epitaxial Drift Layer

Abstract

A normally-off β-Ga2O3 metal-oxide-semiconductor field-effect transistor (MOSFET) is proposed using a technology computer-aided design (TCAD) device simulation, which employs an epitaxial drift layer grown on an n-type low-doped body layer. The low-doped body layer under the MOS gate enabled normally-off operation, whereas the epitaxial drift layer determined the on-resistance and breakdown characteristics. The effects of the doping concentration of each layer and thickness of the drift channel layer on the device characteristics were investigated to design a device with a breakdown voltage of 1 kV. A threshold voltage of 1.5 V and a breakdown voltage of 1 kV were achieved by an n-type body layer with a doping concentration of 1 × 1015 cm−3 and an n-type drift layer with a doping concentration of 3 × 1017 cm−3, a thickness of 150 nm, and a gate-to-drain distance of 9.5 μm; resulting in an on-resistance of 25 mΩ·cm2.