Evaluation of different approaches for HJT cells metallization based on low temperature copper paste

Abstract

Photovoltaic applications (PV) have seen widespread adoption in the last decade and are considered a cornerstone technology that can make the world greener and environmentally friendly. Constant efforts have been put by PV research on developing alternative solar cells concepts to mainstream PERC solar cells, with HJT and Topcon being the most investigated. Despite all the improvements that the field has reached, one primary issue must be solved: silver consumption. According to the forecasts for 2050, there might not be enough silver available to support the PV expansions. So, alternative metallization materials must be evaluated. In this work we focused on copper-based paste for screen printing (SP) on heterojunction (HJT) solar cells, including paste characterisation and solar cell evaluation interconnection and reliability testing.