Abstract
In this paper, we investigated an experimental analysis of the degradation caused by low dose rate irradiation in GaN-based high-electron-mobility transistors (HEMTs) with a p-type gate. Combined with experimental frequency-dependent conductance (Gp/?) analyses and TCAD simulations, it has been demonstrated that the negative shifts in both Id-Vgs and Vth are primarily due to the formation of donor-like traps near the p-GaN/AlGaN interface, which is a result of the dehydrogenation of pre-existing defects during low dose rate irradiation. Additionally, the results of the TCAD simulations, indicate that the trap-assisted tunneling (TAT) process, which involves the recombination of trap-assisted holes with electrons in the p-GaN layer, may dominate the physical mechanisms responsible for the increase in gate leakage current (Ig-Vgs). These results may provide a basis for understanding the role of radiation-induced traps on electrical parameters degradations for p-GaN gate HEMTs.
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Li, X., Wang, X., Liu, M., Zhu, K., Shui, G., Zheng, Q., … Guo, Q. (2024). Degradation Mechanisms of Gate Leakage in GaN-Based HEMTs at Low Dose Rate Irradiation. IEEE Access, 12, 35410–35416. https://doi.org/10.1109/ACCESS.2024.3368870
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