Electromechanical behaviour of a finite piezoelectric layer under a flat punch

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Abstract

This paper solves the problem of a smooth and frictionless punch on a piezoelectric ceramic layer. Different electrical boundary conditions that employ conducting or insulating punches are presented. The stress and electric displacement intensity factors are used to characterize the electromechanical fields at the punch tip. The field intensity factors are obtained numerically for finite layer thickness. Effects of the thickness of the piezoelectric layer on the stress and electric displacement, and the stress and electric displacement intensity factors at the punch tip are discussed. Solution technique for two identical and collinear surface punches on the piezoelectric layer is also provided and the effect of relative distance between the punches is investigated. Numerical results for some interesting special cases, such as conducting punch and insulating punch, and infinite piezoelectric layer thickness, are presented. © 2008 Elsevier Ltd. All rights reserved.

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Wang, B. B. L., Han, J. C., Du, S. Y., Zhang, H. Y., & Sun, Y. G. (2008). Electromechanical behaviour of a finite piezoelectric layer under a flat punch. International Journal of Solids and Structures, 45(25–26), 6384–6398. https://doi.org/10.1016/j.ijsolstr.2008.08.001

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