Verification of empirical warp-based design criteria of space electronic boards

Abstract

Space electronics are subjected to severe vibration environment. The present paper examines empirical warp-based design rules of electronic boards, i.e., criteria verifying that the ratio of maximum board warp to its length remains below a threshold percentage. An analytical approach assessed that peak stress of the board stems better from its curvature than its warp. The same applies to the adhesive peak stress by investigating a finite element model of an adhesively bonded component. Alternatively, a modified formulation based on board curvature is proposed and a threshold curvature is assessed.