A Simulation Based Development of Process Signatures for Manufacturing Processes with Thermal Loads

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Abstract

The newly developed concept of Process Signatures enables the comparison of surface integrity achieved by seemingly different manufacturing processes. This paper suggests Process Signatures for grinding and induction heating. Based on finite element simulations of both processes the relevant internal material loads are identified and are correlated with the simulated residual stress state. To provide a comparable simulation approach the moving heat source theory is applied and combined with energetic quantities. The investigations show that grinding and induction heating are similar for certain parameter regimes regarding the generated residual stress state of the workpiece surface layer.

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Frerichs, F., Sölter, J., Lübben, T., Brinksmeier, E., & Zoch, H. W. (2016). A Simulation Based Development of Process Signatures for Manufacturing Processes with Thermal Loads. In Procedia CIRP (Vol. 45, pp. 327–330). Elsevier B.V. https://doi.org/10.1016/j.procir.2016.03.039

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