Substrate Transfer Technology for Stretchable Electronics

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Abstract

This paper focuses on the implementation of a new technique for the fabrication of stretchable electronic patches that can be used for medical applications. The technique is based on the Electronics on Plastics by Laser Release (EPlaR) technology which enables a one-step release of a stack of flexible/stretchable layers incorporating the active layers like interconnects and embedded devices. As a proof of concept meander shaped polyimide (PI) structures are fabricated on top of a glass substrate and then transferred to a PDMS substrate with the use of this technology. The stretchability in the device is enhanced by fabricating these meander shaped structures free from the PDMS substrate hence giving them the freedom to move out of plane.

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APA

Joshi, S., Savov, A., & Dekker, R. (2016). Substrate Transfer Technology for Stretchable Electronics. In Procedia Engineering (Vol. 168, pp. 1555–1558). Elsevier Ltd. https://doi.org/10.1016/j.proeng.2016.11.459

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