Thermal fracture analysis of nonhomogeneous piezoelectric materials using an interaction energy integral method

15Citations
Citations of this article
8Readers
Mendeley users who have this article in their library.

Abstract

This paper presents a modified interaction energy integral method to analyze the thermal stress intensity factors (TSIFs) and electric displacement intensity factor (EDIF) in nonhomogeneous piezoelectric materials under thermal loading. This modified method is demonstrated to be domain-independent, even when the nonhomogeneous piezoelectric materials contain interfaces with thermo-electro-mechanical properties. As a result, the method is shown to be convenient for determining the TSIFs and EDIF in nonhomogeneous piezoelectric materials with interfaces. Several examples are shown, and they successfully verify the domain-independence of the present interaction energy integral. The study results also show that the mismatch of material properties can significantly influence the TSIFs and EDIF, particularly when the crack tip is close to the interface. Crack angles and temperature boundary conditions are also shown to significantly influence the TSIFs and EDIF. © 2013 Elsevier Ltd. All rights reserved.

Cite

CITATION STYLE

APA

Guo, F., Guo, L., Yu, H., & Zhang, L. (2014). Thermal fracture analysis of nonhomogeneous piezoelectric materials using an interaction energy integral method. International Journal of Solids and Structures, 51(3–4), 910–921. https://doi.org/10.1016/j.ijsolstr.2013.11.022

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free