The problem of thermal model application for the determination of semiconductor device packaging quality is discussed. A method is presented for determination of a fault during a thermal test and 'on-line' indication of the fault source. The objective of the method lies in the immediate comparison of measurement results with reference characteristics received from a model. © 1989.
Nowakowski, A., & Gajkiewicz, J. (1989). Application of thermal models in production measurements of semiconductor devices. Measurement, 7(2), 64–67. https://doi.org/10.1016/0263-2241(89)90004-3