Application of thermal models in production measurements of semiconductor devices

  • Nowakowski A
  • Gajkiewicz J
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Abstract

The problem of thermal model application for the determination of semiconductor device packaging quality is discussed. A method is presented for determination of a fault during a thermal test and 'on-line' indication of the fault source. The objective of the method lies in the immediate comparison of measurement results with reference characteristics received from a model. © 1989.

Author-supplied keywords

  • Semiconductor devices
  • quality control
  • thermal parameters

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Authors

  • A. Nowakowski

  • J. Gajkiewicz

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