Construction of one-, two- and three-dimensional Cu(I) polymeric architectures containing bis(diphenylphosphino)acetylene and 4,4′-bipyridine linking ligands

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Abstract

One-dimensional {[Cu2(dppa)2(4,4′-bipy)(CH3CN)2](BF4)2 · 2CH3CN}n (1), two-dimensional {[Cu2(dppa)(4,4′-bipy)2(CH3CN)2](BF4)2 · 4CH2Cl2 · 4H2O}n (2) and three-dimensional {[Cu2(dppa)(4,4′-bipy)3](BF4)2 · 2CH2Cl2 · 3CH3CN · 3H2O}n (3) polymeric complexes have been prepared by self-assembly of [Cu(MeCN)4]BF4, Ph2PC{triple bond, long}CPPh2 (dppa) and 4,4′-bipyridine (4,4′-bipy) in a 2:2:1, 1:1:1 and 2:2:3 molar ratio, respectively. The structures of 1-3, determined by an X-ray diffraction study, reveal a linear spring-like architecture for 1, a planar honeycomb grid for 2 and an interlocked adamantoid network for 3. © 2009 Elsevier B.V. All rights reserved.

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Liu, Y. C., Yeh, W. Y., Lee, G. H., & Kuo, T. S. (2009). Construction of one-, two- and three-dimensional Cu(I) polymeric architectures containing bis(diphenylphosphino)acetylene and 4,4′-bipyridine linking ligands. Inorganica Chimica Acta, 362(10), 3595–3599. https://doi.org/10.1016/j.ica.2009.04.003

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