Crack resistance behaviour of an intermetallic Ti-Al-Si-Nb alloy at room temperature

  • Wittkowsky B
  • Pfuff M
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The room temperature crack growth behaviour of a Ti-Al-Si-Nb alloy consisting of the two intermetallic phases (Ti, Nb)3(Al, Si) and (Ti, Nb)5(Si, Al)3is investigated in the present paper. The material exhibits a heterogeneous disordered microstructure and fails in a brittle manner. Crack growth is associated with a pronounced crack resistance behaviour. For a sample of nominally identical specimens the R-curves scatter around a mean curve with a standard deviation which remains roughly constant as the crack grows. A natural extension of the bundle model introduced in a previous paper is used to simulate R-curves and their scatter is in reasonably good agreement with the experimental findings.

Author-supplied keywords

  • Crack resistance
  • Ti-Al-Si-Nb alloy

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  • B. U. Wittkowsky

  • M. J. Pfuff

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