Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films

  • Zhou H
  • Shi F
  • Zhao B
 et al. 
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Author-supplied keywords

  • conduction mechanism
  • deposition methods
  • dielectric breakdown strength
  • low-k dielectric
  • plasma-enhanced chemical vapor deposition
  • temperature dependent
  • thickness dependent
  • time dependent

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Authors

  • H Zhou

  • F G Shi

  • B Zhao

  • J Yota

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