The integration of ultra low k materials in copper damascene architecture is one of the main issues in finding microelectronic-process-compatible dielectric materials. The aim of this paper is to show the integration conformity with common equipment and process steps using a PECVD (plasma enhanced chemical vapor deposition) CF polymer ultra low k material in a Cu single damascene architecture (Proceedings of the Advanced Metallization Conference, 2002). The intermetal dielectric low k material used in the described structures has 2.1≤k≤2.3 (k depends on deposition process parameters [Microelectron. Eng. 50 (2000) 7-14]) and the copper was deposited by a metal organic chemical vapor deposition process. After chemical mechanical polishing the structures were characterized by scanning electron microscopy and electrical measurements. © 2003 Elsevier B.V. All rights reserved.
Uhlig, M., Bertz, A., Erben, J. W., Schulz, S. E., Gessner, T., Zeidler, D., … Bartha, J. (2003). Experimental results on the integration of copper and CVD ultra low k material. In Microelectronic Engineering (Vol. 70, pp. 314–319). https://doi.org/10.1016/S0167-9317(03)00415-5