Growth and surface morphology of ion-beam sputtered Ti-Ni thin films

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Abstract

Titanium-nickel thin films have been deposited on float glass substrates by ion beam sputtering in 100% pure argon atmosphere. Sputtering is predominant at energy region of incident ions, 1000 eV to 100 keV. The as-deposited films were investigated by X-ray photoelectron spectroscopy (XPS) and atomic force microscope (AFM). In this paper we attempted to study the surface morphology and elemental composition through AFM and XPS, respectively. Core level as well as valence band spectra of ion-beam sputtered Ti-Ni thin films at various Ar gas rates (5, 7 and 12 sccm) show that the thin film deposited at 3 sccm possess two distinct peaks at binding energies 458.55 eV and 464.36 eV mainly due to TiO2. Upon increasing Ar rate oxidation of Ti-Ni is reduced and the Ti-2p peaks begin approaching those of pure elemental Ti. Here Ti-2p peaks are observed at binding energy positions of 454.7 eV and 460.5 eV. AFM results show that the average grain size and roughness decrease, upon increasing Ar gas rate, from 2.90 μm to 0.096 μm and from 16.285 nm to 1.169 nm, respectively. © 2008 Elsevier B.V. All rights reserved.

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Rao, A. P., & Sunandana, C. S. (2008). Growth and surface morphology of ion-beam sputtered Ti-Ni thin films. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 266(8), 1517–1521. https://doi.org/10.1016/j.nimb.2007.12.061

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