9Citations
Citations of this article
2Readers
Mendeley users who have this article in their library.
Get full text

Abstract

The interfacial reaction between Sn/Au bumps and a thin Au/TiW metallization was investigated. It was found that for 60 μm bumps, the pad metallization was not reliable and large voids were generated after multiple reflow cycles due to the dewetting between eutectic AuSn and TiW. For 40 and 20 μm bumps, the Au/TiW was quite stable and the joints could be entirely composed of TiW/Au5Sn/Au because of the wetting on the side walls of the Au socket. © 2007 Acta Materialia Inc.

Cite

CITATION STYLE

APA

Yu, D. Q., Oppermann, H., Kleff, J., & Hutter, M. (2008). Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow. Scripta Materialia, 58(7), 606–609. https://doi.org/10.1016/j.scriptamat.2007.11.020

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free