Near-interfacial delamination failures observed in ion-beam-sputtered Ta2O5/SiO2 multi-layer stacks

  • Grigonis M
  • Hebenstreit W
  • Tilsch M
  • 1


    Mendeley users who have this article in their library.
  • 3


    Citations of this article.


Ion-beam-sputtered Ta2O5/SiO2multi-layer stacks have been mechanically stressed to failure. The delamination failures do not occur precisely at the layer interfaces. XPS and AFM analyses indicate that the failures occur near the interfaces where SiO2was deposited on Ta2O5. Delamination is not observed near the interfaces where Ta2O5was deposited on SiO2. The failure location is 2-3 nm into Ta2O5layers and can occur randomly near multiple interfaces within a test. The delamination failures were induced by performing tape pull tests over lines scribed into the multi-layer coatings. © 2007 Elsevier B.V. All rights reserved.

Author-supplied keywords

  • Delamination
  • Ion-beam sputtering
  • Multi-layers
  • Ta2O5/SiO2

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document


  • Marius Grigonis

  • Wilhelm Hebenstreit

  • Markus K. Tilsch

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free